In the 2018 Taipei International Computer Show (COMPUTEX 2018), the Taiwan Institute of Technology showed the world's first Micro LED display module that directly transferred Micro LED chips to PCB substrates. This also means that the display module has great potential for cost reduction in the future, and can be applied to products such as video walls and indoor signage through splicing.
Different from SONY's Micro LED display - CLEDIS, which was introduced in 2017, although the PCB substrate is also used as the backplane, due to the poor flatness of the PCB substrate, there is no way for the micron-sized chip to be directly on the PCB substrate. Therefore, it is still necessary to make the Micro LED chip into a package type and then transfer it to the top of the PCB. The program shown by the Taiwan Institute of Technology has overcome this problem. This also means that the future Micro LED display module will have more possibilities to reduce costs. According to LEDinside, at present, the cost of the module is much cheaper than the traditional small-pitch display. In the future, once the technology is mature, there will be opportunities to subvert the traditional commercial display market.
The Taiwan Industrial Research Institute and the first-line manufacturers have jointly developed and speculated that there will be opportunities for mass production in 2019.The products exhibited by the Taiwan Institute of Technology are jointly developed by the first-line manufacturers in Taiwan and China, such as Xinxing and Yuchuang.
♦ LED driver IC factory accumulation technology, responsible for passive matrix drive solutions to solve how to drive and correct micron-level LED chips.
♦ PCB factory Xinxing Electronics is responsible for manufacturing PCB substrates.
♦ The semiconductor factory has created a technology to assist in mass production of Micro LED chips designed by Taiwan Institute of Technology.
Through the cooperation between the Institute and the No. 3 Plant, the passive matrix drive “Ultra Small Pitch Micro LED Display Module†was developed. The LED die size is between 50μm and 80μm, and the pitch is less than 800μm. The module measures 6 cm x 6 cm and has a resolution of 80 x 80 pixels. It can be freely spliced ​​and used in applications such as video walls and indoor signage.
However, there are still some technical bottlenecks to be overcome at this stage. Although the ultra-small pitch Micro LED display module has achieved color, it is not "RGB full color". The main reason is that the red LED is limited by its own material characteristics, plus The traditional PCB board has a certain roughness, and the color rendering after transfer is easily affected. This also highlights the difficulty of transferring the Micro LED directly to the PCB substrate, and the uniformity is not easy to control. At present, the technical obstacles are still being overcome.
Looking ahead, the ultra-small-pitch Micro LED display module will be responsible for the landing and commercialization of this technology, and will be introduced into the market for display applications that are best at accumulating. LEDinside speculates that by 2019, it is expected that the Micro LED display will appear around you and me.
Same field addition - transparent display module solutionAs for the other Micro LED transparent display module exhibited on site, the specifications are almost the same as those of the ultra-small pitch Micro LED display module described above. The difference is that the transparent display module uses an ultra-thin glass substrate, which can be RGB in technology. Full color; also because Micro LED has a small proportion of pixel area, transparency can reach more than 60%, coupled with ultra-high brightness characteristics, it is more suitable for outdoor field applications, including display windows, interactive screens, automatic Vending machines, etc.
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