[Reporter/Wang Cairong] At the same time as the integration of LED industry chain, middle and downstream industries has gradually accelerated, the rapid development of the domestic packaging equipment market in recent years has also kicked off the reshuffle knockout.
At the beginning of 2014, Moso Power (002660.SZ) and Yuanfang Optoelectronics (300306.SZ) successively announced investment announcements, announcing the expansion of LED packaging and downstream lighting automation equipment market.
In recent years, the rapid development of the LED industry has greatly stimulated the advancement of domestic packaging equipment technology, and also brought huge potential market space for related equipment R&D enterprises.
According to statistics from the High-tech LED Industry Research Institute (GLII), the market size of China's LED packaging equipment reached 8.6 billion yuan in 2012. It is expected to reach 9.8 billion yuan in 2013, an increase of 14% year-on-year.
However, with the increasing number of new companies entering the field, the development of the packaging equipment market has shown a fierce competition. At the same time, the volatility of equipment market demand caused by the phased expansion of downstream packaging manufacturers will also be one of the biggest challenges for equipment manufacturers' revenue growth this year.
Overall market demand growth slows
"From the current market demand, the capacity of the packaged equipment enterprises that have been invested is far greater than the market demand. Because the continuous use of equipment has a certain depreciation cycle, it can only be eliminated after the new technology and new technology come out." Shenzhen Cui Tao Automation Deng Suimin, general manager of Optoelectronics Division of Equipment Co., Ltd. told the reporter of "High-tech LED" that the growth of the packaging equipment market still depends on the maturity of the relevant supporting industrial chain, from upstream chips to mid-stream packaging, if the relevant technology is mature, equipment requirements The amount will rise.
Deng Sui-min believes that from the sales situation of domestic mainstream LED packaging equipment manufacturers in the past year, the growth rate of the overall packaging equipment market demand has actually slowed down, and the days of most domestic packaging equipment manufacturers are not too good.
In the core key equipment areas such as front-end crystallizers and wire bonding machines, due to the high technical content, the imported equipment manufacturers such as ASM, Musashi and K&S are still dominant in the market, such as Xinyichang and Advanced Optoelectronics (Yuguang) Domestic equipment manufacturers such as equipment and Dazu Optoelectronics have seen a slight improvement in recent years, but the overall market share is still slow.
Market concentration increases cluster effect and intensifies integration
“Actually, in the field of front-end equipment such as solid crystal machines and wire bonding machines, domestic packaging equipment manufacturers have been robbing some orders in the form of customers in installments, but they have not brought us a big impact. An ASM insider revealed to reporters that under normal circumstances, domestic and international LED first-line packaging manufacturers are purchasing imported packaging equipment, and only enterprises lacking funds will choose to purchase domestic solid crystal and wire bonding equipment.
The above-mentioned people admit that, on the whole, whether it is imported equipment manufacturers such as ASM or domestic packaging manufacturers, their orders in the mainland market are decreasing in 2013, and the overall demand growth in the domestic market seems to be slowing down.
“ASM's order volume began to improve in the second and third quarters of 2013. Although orders have decreased, our sales are still growing steadily. At present, our SMD die bonder equipment market share in mainland China is about 70%. The market share of photoelectric wire bonding equipment is 85%, which is a slight decline compared to the previous two years."
It is worth noting that with the current integration of M&A in the entire LED industry, the concentration of the packaging market is rapidly increasing, and the cluster effect is becoming more and more obvious. Some small and medium-sized enterprises that lack financial support will be eliminated. This will undoubtedly bring greater market competition pressure to the domestic packaging equipment enterprises that are difficult to be among the first-line packaging manufacturers' supply chains, thus accelerating the elimination and integration of the packaging equipment industry.
In the field of back-end equipment such as splitting and braiding, the market share of domestic equipment enterprises has increased rapidly. In particular, a number of domestic equipment companies represented by Zhongwei Optoelectronics have rapidly increased their market share in recent years, and they have occupied the whole country by the end of 2013. More than 70% of the market share.
However, the imported equipment manufacturers represented by ASM rely on the advantages of solid crystal and wire bonding equipment, and the way of bundled sales of back-end spectrometers and tape-splitting equipment has also hindered the market expansion of domestic equipment manufacturers to some extent.
In addition, in recent years, the popularity of COB and flip chip packaging has led many domestic packaging equipment manufacturers to enter the field of equipment, and although foreign imported equipment manufacturers have already taken the lead in these fields, they are reserved for domestic equipment manufacturers. The market outlook is still broad.
"The competition in the field of packaging equipment in the future depends on technology and strength competition. If technology catches up, it will have an advantage. Enterprises that rely on plagiarism will inevitably go bankrupt." Deng Suimin is still optimistic about the emerging packaging equipment market prospects, although COB, flip-chip Front-end packaging equipment such as high-power is still in the early stage in China, but the packaging equipment market such as new technologies and new technologies is currently in short supply. There are still great opportunities for domestic packaging equipment manufacturers with technological advantages.
At the beginning of 2014, Moso Power (002660.SZ) and Yuanfang Optoelectronics (300306.SZ) successively announced investment announcements, announcing the expansion of LED packaging and downstream lighting automation equipment market.
In recent years, the rapid development of the LED industry has greatly stimulated the advancement of domestic packaging equipment technology, and also brought huge potential market space for related equipment R&D enterprises.
According to statistics from the High-tech LED Industry Research Institute (GLII), the market size of China's LED packaging equipment reached 8.6 billion yuan in 2012. It is expected to reach 9.8 billion yuan in 2013, an increase of 14% year-on-year.
However, with the increasing number of new companies entering the field, the development of the packaging equipment market has shown a fierce competition. At the same time, the volatility of equipment market demand caused by the phased expansion of downstream packaging manufacturers will also be one of the biggest challenges for equipment manufacturers' revenue growth this year.
Overall market demand growth slows
"From the current market demand, the capacity of the packaged equipment enterprises that have been invested is far greater than the market demand. Because the continuous use of equipment has a certain depreciation cycle, it can only be eliminated after the new technology and new technology come out." Shenzhen Cui Tao Automation Deng Suimin, general manager of Optoelectronics Division of Equipment Co., Ltd. told the reporter of "High-tech LED" that the growth of the packaging equipment market still depends on the maturity of the relevant supporting industrial chain, from upstream chips to mid-stream packaging, if the relevant technology is mature, equipment requirements The amount will rise.
Deng Sui-min believes that from the sales situation of domestic mainstream LED packaging equipment manufacturers in the past year, the growth rate of the overall packaging equipment market demand has actually slowed down, and the days of most domestic packaging equipment manufacturers are not too good.
In the core key equipment areas such as front-end crystallizers and wire bonding machines, due to the high technical content, the imported equipment manufacturers such as ASM, Musashi and K&S are still dominant in the market, such as Xinyichang and Advanced Optoelectronics (Yuguang) Domestic equipment manufacturers such as equipment and Dazu Optoelectronics have seen a slight improvement in recent years, but the overall market share is still slow.
Market concentration increases cluster effect and intensifies integration
“Actually, in the field of front-end equipment such as solid crystal machines and wire bonding machines, domestic packaging equipment manufacturers have been robbing some orders in the form of customers in installments, but they have not brought us a big impact. An ASM insider revealed to reporters that under normal circumstances, domestic and international LED first-line packaging manufacturers are purchasing imported packaging equipment, and only enterprises lacking funds will choose to purchase domestic solid crystal and wire bonding equipment.
The above-mentioned people admit that, on the whole, whether it is imported equipment manufacturers such as ASM or domestic packaging manufacturers, their orders in the mainland market are decreasing in 2013, and the overall demand growth in the domestic market seems to be slowing down.
“ASM's order volume began to improve in the second and third quarters of 2013. Although orders have decreased, our sales are still growing steadily. At present, our SMD die bonder equipment market share in mainland China is about 70%. The market share of photoelectric wire bonding equipment is 85%, which is a slight decline compared to the previous two years."
It is worth noting that with the current integration of M&A in the entire LED industry, the concentration of the packaging market is rapidly increasing, and the cluster effect is becoming more and more obvious. Some small and medium-sized enterprises that lack financial support will be eliminated. This will undoubtedly bring greater market competition pressure to the domestic packaging equipment enterprises that are difficult to be among the first-line packaging manufacturers' supply chains, thus accelerating the elimination and integration of the packaging equipment industry.
In the field of back-end equipment such as splitting and braiding, the market share of domestic equipment enterprises has increased rapidly. In particular, a number of domestic equipment companies represented by Zhongwei Optoelectronics have rapidly increased their market share in recent years, and they have occupied the whole country by the end of 2013. More than 70% of the market share.
However, the imported equipment manufacturers represented by ASM rely on the advantages of solid crystal and wire bonding equipment, and the way of bundled sales of back-end spectrometers and tape-splitting equipment has also hindered the market expansion of domestic equipment manufacturers to some extent.
In addition, in recent years, the popularity of COB and flip chip packaging has led many domestic packaging equipment manufacturers to enter the field of equipment, and although foreign imported equipment manufacturers have already taken the lead in these fields, they are reserved for domestic equipment manufacturers. The market outlook is still broad.
"The competition in the field of packaging equipment in the future depends on technology and strength competition. If technology catches up, it will have an advantage. Enterprises that rely on plagiarism will inevitably go bankrupt." Deng Suimin is still optimistic about the emerging packaging equipment market prospects, although COB, flip-chip Front-end packaging equipment such as high-power is still in the early stage in China, but the packaging equipment market such as new technologies and new technologies is currently in short supply. There are still great opportunities for domestic packaging equipment manufacturers with technological advantages.
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